Close CTE matching
( 9.0 ppm/°C at room temperature)
to GaAs die and alumina or LTCC substrates.
Thermally stable
and stiff, with 6 times the thermal
conductivity of Kovar.
One sixth, one
quarter and one third the weight of
Cu/W, Cu/Mo or Kovar respectively.
Machinable and
plateable. Improved machinability
vs. CE7.
Typical applications
include RF and microwave packages,
electro-optical housings, base plates
for power devices and carrier plates
for high frequency circuits.