Very
close CTE matching (7.4 ppm/°C at
room temperature) to GaAs die and
alumina or LTCC substrates.
Thermally
stable and stiff, with 6 times the
thermal conductivity of Kovar
One
sixth, one quarter and one third
the weight of Cu/W, Cu/Mo and Kovar
respectively.
Machinable
and plateable.
Typical
applications include RF and microwave
packages, electro-optical housings,
base plates for power devices and
carrier plates for high frequency
circuits.