Offers improved
CTE matching (12.8 ppm/°C at room
temperature) to electronic circuit
boards compared to aluminium, copper
or steel. In many cases, reliable
carrier for most ceramic substrates
and device materials, including alumina
and GaAs.
One third
the weight of copper.
Lower cost
material and easy to machine with
lower machining costs vs. CE7, CE9
or CE11. Weldable and plateable.
Typical
applications include electronic packages
and components for inertial systems.